About UsMicrochip Releases New Bluetooth Low Energy RF IC's
Up to 2.5 times Faster Data Transfer Speeds and Improved Connection Security
Microchip has released its next-generation Bluetooth® Low Energy (LE) solutions. Qualified to the latest Bluetooth 4.2 standard, the IS1870 and IS1871 Bluetooth LE RF ICs, along with the BM70 module, expand Microchip’s existing Bluetooth portfolio and carry both worldwide regulatory and Bluetooth Special Interest Group (SIG) certifications. These new offerings are ideal for Internet of Things and Bluetooth Beacon applications, and make it easy for designers to take advantage of the low power consumption and simplicity of Bluetooth LE connectivity.
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Microchip’s new Bluetooth LE devices include an integrated, certified Bluetooth 4.2 firmware stack. Developers can expect up to 2.5 times faster data transfer speeds and greater connection security, with government-grade (FIPS-based) secure connection support. Data is sent and received over the Bluetooth link using Transparent UART mode, making it easy to integrate with any processor or the hundreds of Microchip’s PIC® microcontrollers that have a UART interface. The module also supports standalone "hostless" operation for beacon applications.
“The IS1870 and IS1871 ICs bring cutting-edge Bluetooth 4.2 performance to our chip-down customers, and our BM70 module enables customers to avoid the expense and product delays caused by regulatory certifications,” said Sumit Mitra, vice president of Microchip’s Wireless Solutions Group. “By offering one-stop shopping, including our own Bluetooth stack, customers gain proven interoperability and the convenience of a single point of contact for support from Microchip's worldwide staff of wireless specialists.”
The optimized power profile of these new devices minimizes current consumption for extended battery life, in compact form factors as small as 4x4 mm for the RF ICs and 15x12 mm for the module. The module options include RF regulatory certifications, or non-certified (unshielded/antenna-less) for smaller and more remote antenna designs that will undergo end-product emission certifications.
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Microchip’s Bluetooth LE modules include all of the hardware, software and certifications that designers need. Developers can leverage Microchip’s Bluetooth Qualified Design ID (QDID) to easily list their products with the Bluetooth SIG. Embedded Bluetooth stack profiles include GAP, GATT, ATT, SMP and L2CAP, as well as proprietary services for Transparent UART. All modules are configurable using Microchip's Windows® OS-based tools.
Features of the BM70 Bluetooth Low Energy Module
- Bluetooth 5 Certified
- Module certified for use in USA, Canada, Europe, Japan, Korea, Taiwan and China
- Mobile Application supported in Microchip Bluetooth Data
- Supports LE Secure Connections levels 1-3
- UART interface
- 3 x PWM supported
- Main Crystal : 32MHz
- Temperature sensor supported
- 12 bits ADC supported for 8CH input ports and battery voltage detection
- Wake up by any GPIO
- RSSI Monitor
- ISM Band 2.402 to 2.480 GHz operation
- Channels 0-39
- Rx Sensitivity: -90 dBm @ BLE, in typical
- Tx Power: +2 dBm
- RSSI monitor
More information on the IS1870 Bluetooth LE module can be found on the Microchip website at Microchip IS1870 Module product page.
Note: The Microchip name and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A and other countries. All other trademarks mentioned herein are the property of their respective companies.
The Microchip website address is www.microchip.com
[Reprinted with kind permission from Microchip Corporation - Release Date, 2nd November, 2015]