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New MSP430 Microcontrollers from TI with Capacitive Touch Sensing
Add as many as 16 touch sensing buttons with the new MSP430FR2512 and MSP430FR2522 MCUs
Texas Instruments has announced an expansion of its MSP430™ microcontroller (MCU) family with
CapTIvate™ technology. Developers can use the new MSP430FR2512 and MSP430FR2522 MCUs
with integrated capacitive touch to add as many as 16 buttons as well as proximity sensing capability
to industrial systems, home automation systems, appliances, power tools, home entertainment,
personal audio applications and more.
Production quantities of the MSP430FR2512 and MSP430FR2522 MCUs are available in a
20-pin very thin quad flat no lead (VQFN) package and a 16-pin thin shrink small outline package (TSSOP).
Key features of the MSP430FR2512 and MSP430FR2522 MCUs
- Robust, optimized performance: The MSP430FR2512 and MSP430FR2522 MCUs deliver
International Electrotechnical Commission (IEC) 61000-4-6-certified capacitive sensing MCU-based solutions
for applications exposed to electromagnetic disturbances, oil, water and grease.
The new MCUs offer five times lower power consumption than the competition,
supporting proximity sensing and touch through glass, plastic and metal overlays.
- Capacitive touch MCUs for cost-sensitive applications: TI's CapTIvate technology adds the benefits
of capacitive touch and proximity sensing to applications such as access control panels,
cooktops, wireless speakers and power tools.
- Speed time to market: Developers can quickly evaluate capacitive sensing for their applications
with the new BOOSTXL-CAPKEYPAD BoosterPack™ plug-in module that is compatible with the
CapTIvate programmer board (CAPTIVATE-PGMR) or TI LaunchPad™ development kits.
The BoosterPack module joins a portfolio of MCUs, easy-to-use tools, software, reference designs and
documentation in the CapTIvate Design Center and online CapTIvate technology guide.
The company's Web site address is www.ti.com
[Reprinted with kind permission from Texas Instruments - Release Date, 27th February, 2018]