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Microchip Release New Bluetooth Low Energy RF IC's Certified to the Latest Bluetooth 4.2 Standard


Up to 2.5 times Faster Data Transfer Speeds and Improved Connection Security


Click for Larger Image - New Bluetooth Low Energy RF ICs

Microchip has released its next-generation Bluetooth® Low Energy (LE) solutions. Qualified to the latest Bluetooth 4.2 standard, the IS1870 and IS1871 Bluetooth LE RF ICs, along with the BM70 module, expand Microchip's existing Bluetooth portfolio and carry both worldwide regulatory and Bluetooth Special Interest Group (SIG) certifications. These new offerings are ideal for Internet of Things and Bluetooth Beacon applications, and make it easy for designers to take advantage of the low power consumption and simplicity of Bluetooth LE connectivity.

Microchip's new Bluetooth LE devices include an integrated, certified Bluetooth 4.2 firmware stack. Developers can expect up to 2.5 times faster data transfer speeds and greater connection security, with government-grade (FIPS-based) secure connection support. Data is sent and received over the Bluetooth link using Transparent UART mode, making it easy to integrate with any processor or the hundreds of Microchip's PIC® microcontrollers that have a UART interface. The module also supports standalone "hostless" operation for beacon applications.

Click for Larger Image - Microchip IS1870 and IS1871 Bluetooth Block Diagram “The IS1870 and IS1871 ICs bring cutting-edge Bluetooth 4.2 performance to our chip-down customers, and our BM70 module enables customers to avoid the expense and product delays caused by regulatory certifications,” said Sumit Mitra, vice president of Microchip's Wireless Solutions Group. “By offering one-stop shopping, including our own Bluetooth stack, customers gain proven interoperability and the convenience of a single point of contact for support from Microchip's worldwide staff of wireless specialists.”

The optimized power profile of these new devices minimizes current consumption for extended battery life, in compact form factors as small as 4x4 mm for the RF ICs and 15x12 mm for the module. The module options include RF regulatory certifications, or non-certified (unshielded/antenna-less) for smaller and more remote antenna designs that will undergo end-product emission certifications.

Microchip's Bluetooth LE modules include all of the hardware, software and certifications that designers need. Developers can leverage Microchip's Bluetooth Qualified Design ID (QDID) to easily list their products with the Bluetooth SIG. Embedded Bluetooth stack profiles include GAP, GATT, ATT, SMP and L2CAP, as well as proprietary services for Transparent UART. All modules are configurable using Microchip's Windows® OS-based tools.


The company's Web site address is www.Microchip.com
[Reprinted with kind permission from Microchip - Release Date, 2nd November, 2015]


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